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MAC7136CAF50 Datasheet(PDF) 9 Page - Freescale Semiconductor, Inc

Part # MAC7136CAF50
Description  Microcontroller Family Hardware Specifications
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

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ElectricalCharacteristics
MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2
Preliminary
Freescale Semiconductor
9
Note that the JEDEC specification reserves the symbol RθJA or θJA (Theta-JA) strictly for junction-to-
ambient thermal resistance on a 1s test board in natural convection environment. RθJMA or θJMA
(Theta-JMA) will be used for both junction-to-ambient on a 2s2p test board in natural convection and for
junction-to-ambient with forced convection on both 1s and 2s2p test boards. It is anticipated that the
generic name,
θ
JA, will continue to be commonly used.
The average chip-junction temperature (TJ) in °C is obtained from the formula:
Eqn. 1
where
The total power dissipation is calculated as:
Eqn. 2
where
Two cases must be considered for PINT:
1. Internal voltage regulator enabled:
Eqn. 3
2. Internal voltage regulator disabled (VDDR = VSSR = system ground):
Eqn. 4
PIO is the sum of all output currents on input/output pins associated with VDDX:
Eqn. 5
where
Eqn. 6
or
Eqn. 7
Table 10. Thermal Resistance 1/8 Simulation Model Packaging Parameters
Component
Conductivity
Mold Compound
0.9 W/m K
Leadframe (Copper)
263 W/m K
Die Attach
1.7 W/m K
T
J
T
A
P
D
Θ
JA
+
=
T
J
Junction Temperature (
°C)
=
T
A
Ambient Temperature (
°C)
=
P
D
Total Chip Power Dissipation (W)
=
Θ
JA
Package Thermal Resistance (
°C/W)
=
P
D
P
INT
P
IO
+
=
P
INT
Chip Internal Power Dissipation (W)
=
P
IO
Input / Output Power Dissipation (W)
=
P
INT
I
DDRVDDR
×
()
I
DDAVDDA
×
()
+
=
P
INT
I
DD2.5
V
DD2.5
×
()
I
DDPLL
V
DDPLL
×
()
I
DDAVDDA
×
()
++
=
P
IO
R
DSON
i
I
IO
i
()2
=
R
DSON
V
OL
I
OL
--------- (for outputs driven low)
=
R
DSON
V
DDXVOH
I
OL
------------------------------- (for outputs driven high)
=


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