Philips Semiconductors

Product specification

N-channel enhancement mode

PHN70308

TrenchMOS transistor array

MECHANICAL DATA

Fig.24. SOT341-1 (SSOP28) surface mounting package.

Notes

1. This product is supplied in anti-static packaging. The leads must be protected against static discharge during

transport or handling.

2. Refer to Integrated Circuit Packages, Data Handbook IC26.

3. Epoxy meets UL94 V0 at 1/8".

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

10.4

10.0

5.4

5.2

0.65

1.25

7.9

7.6

0.9

0.7

1.1

0.7

8

0

o

o

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT341-1

MO-150AH

93-09-08

95-02-04

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

114

28

15

0.25

y

pin 1 index

0

2.5

5 mm

scale

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

SOT341-1

A

max.

2.0

May 1999

9

Rev 1.000