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K7I643684M-FECI30 Datasheet(PDF) 11 Page - Samsung semiconductor |
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K7I643684M-FECI30 Datasheet(HTML) 11 Page - Samsung semiconductor |
11 / 18 page 2Mx36 & 4Mx18 DDRII CIO b4 SRAM K7I643684M K7I641884M - 11 - Rev. 1.3 March 2007 AC ELECTRICAL CHARACTERISTICS (VDD=1.8V ±0.1V, TA=0°C to +70°C) Notes: 1. This condition is for AC function test only, not for AC parameter test. 2. To maintain a valid level, the transition edge of the input must: a) Sustain a constant slew rate from the current AC level through the target AC level, VIL(AC) or VIH(AC) b) Reach at least the target AC level c) After the AC target level is reached, continue to maintain at least the target DC level, VIL(DC) or VIH(DC) PARAMETER SYMBOL MIN MAX UNIT NOTES Input High Voltage VIH (AC) VREF + 0.2 - V 1,2 Input Low Voltage VIL (AC) - VREF - 0.2 V 1,2 AC TIMING CHARACTERISTICS(VDD=1.8V±0.1V, TA=0°C to +70°C) Notes: 1. All address inputs must meet the specified setup and hold times for all latching clock edges. 2. Control singles are R, W,BW0,BW1 and BW2, BW3, also for x36 3. If C,C are tied high, K,K become the references for C,C timing parameters. 4. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN parameter that is worst case at totally different test conditions (0 °C, 1.9V) than tCHQZ, which is a MAX parameter(worst case at 70°C, 1.7V) It is not possible for two SRAMs on the same board to be at such different voltage and temperature. 5. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge. 6. Vdd slew rate must be less than 0.1V DC per 50 ns for DLL lock retention. DLL lock time begins once Vdd and input clock are stable. 7. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ± 0.1 ns variation from echo clock to data. The data sheet parameters reflect tester guard bands and test setup variations. PARAMETER SYMBOL -30 -25 -20 -16 UNIT NOTE MIN MAX MIN MAX MIN MAX MIN MAX Clock Clock Cycle Time (K, K, C, C)tKHKH 3.30 8.40 4.00 8.40 5.00 8.40 6.00 8.40 ns Clock Phase Jitter (K, K, C, C)tKC var 0.20 0.20 0.20 0.20 ns 5 Clock High Time (K, K, C, C)tKHKL 1.32 1.60 2.00 2.40 ns Clock Low Time (K, K, C, C)tKLKH 1.32 1.60 2.00 2.40 ns Clock to Clock (K ↑ → K↑, C↑ → C↑) tKHKH 1.49 1.80 2.20 2.70 ns Clock to data clock (K ↑ → C↑, K↑→ C↑) tKHCH 0.00 1.45 0.00 1.80 0.00 2.30 0.00 2.80 ns DLL Lock Time (K, C) tKC lock 1024 1024 1024 1024 cycle 6 K Static to DLL reset tKC reset 30 30 30 30 ns Output Times C, C High to Output Valid tCHQV 0.45 0.45 0.45 0.50 ns 3 C, C High to Output Hold tCHQX -0.45 -0.45 -0.45 -0.50 ns 3 C, C High to Echo Clock Valid tCHCQV 0.45 0.45 0.45 0.50 ns C, C High to Echo Clock Hold tCHCQX -0.45 -0.45 -0.45 -0.50 ns CQ, CQ High to Output Valid tCQHQV 0.27 0.30 0.35 0.40 ns 7 CQ, CQ High to Output Hold tCQHQX -0.27 -0.30 -0.35 -0.40 ns 7 C, High to Output High-Z tCHQZ 0.45 0.45 0.45 0.50 ns 3 C, High to Output Low-Z tCHQX1 -0.45 -0.45 -0.45 -0.50 ns 3 Setup Times Address valid to K rising edge tAVKH 0.40 0.50 0.60 0.70 ns Control inputs valid to K rising edge tIVKH 0.40 0.50 0.60 0.70 ns 2 Data-in valid to K, K rising edge tDVKH 0.30 0.35 0.40 0.50 ns Hold Times K rising edge to address hold tKHAX 0.40 0.50 0.60 0.70 ns K rising edge to control inputs hold tKHIX 0.40 0.50 0.60 0.70 ns K, K rising edge to data-in hold tKHDX 0.30 0.35 0.40 0.50 ns |
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