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PDI1394L21 Datasheet(PDF) 8 Page - NXP Semiconductors |
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PDI1394L21 Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 52 page Philips Semiconductors Preliminary specification PDI1394L21 1394 full duplex AV link layer controller 1999 Aug 06 8 9.5 Other Pins PIN No. PIN SYMBOL I/O NAME AND FUNCTION 65, 66, 67 RESERVED NA These pins are reserved for factory testing. For normal operation they should be connected to ground. 51, 62, 100 N/C NA These pins should not be connected or terminated. 30 CYCLEIN I Provides the capability to supply an external cycle timer signal for the beginning of 1394 bus cycles. 33 CYCLEOUT O Reproduces the 8kHz cycle clock of the cycle master. 11 CLK25 O Auxiliary clock, value is SCLK/2 (usually 24.576 MHz) 10.0 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS LIMITS UNIT SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage 3.0 3.6 V VI Input voltage 0 5 V VIH High-level input voltage 2.0 V VIL Low-level input voltage 0.8 V IOH High-level output current 8 mA IOL Low-level output current –8 mA dT/dV Input transition rise or fall time 0 20 ns/V Tamb Operating ambient temperature range 0 +70 °C SCLK System clock 49.147 49.157 MHz AVCLK AV interface clock 0 24 MHz tr Input rise time 10 ns tf input fall time 10 ns 11.0 ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V). SYMBOL PARAMETER CONDITIONS LIMITS UNIT SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VDD DC supply voltage –0.5 +4.6 V IIK DC input diode current – –50 mA VI DC input voltage –0.5 +5.5 V IOK DC output diode current – ±50 mA VO DC output voltage –0.5 VDD +0.5 V IO DC output source or sink current – ±50 mA IGND, ICC DC VCC or GND current – ±150 mA Tstg Storage temperature range –60 150 °C Tamb Operating ambient temperature 0 70 °C Ptot Power dissipation per package 0.6 W NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. |
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