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NLAST44599MNR2 Datasheet(PDF) 3 Page - ON Semiconductor |
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NLAST44599MNR2 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 12 page NLAST44599 http://onsemi.com 3 MAXIMUM RATINGS Symbol Parameter Value Unit VCC Positive DC Supply Voltage *0.5 to )7.0 V VIS Analog Input Voltage (VNO or VCOM) *0.5 ≤ VIS ≤ VCC )0.5 V VIN Digital Select Input Voltage *0.5 ≤ VI ≤ )7.0 V IIK DC Current, Into or Out of Any Pin $50 mA PD Power Dissipation in Still Air QFN−16 TSSOP−16 800 450 mW TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL−94−VO (0.125 in) VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) 2000 200 1000 V ILATCH−UP Latch−Up Performance Above VCC and Below GND at 125°C (Note 4) $300 mA qJA Thermal Resistance QFN−16 TSSOP−16 80 164 °C/W Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 2.0 5.5 V VIN Digital Select Input Voltage GND 5.5 V VIS Analog Input Voltage (NC, NO, COM) GND VCC V TA Operating Temperature Range *55 )125 °C tr, tf Input Rise or Fall Time, SELECT VCC = 3.3 V $ 0.3 V VCC = 5.0 V $ 0.5 V 0 0 100 20 ns/V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 3. Failure Rate vs. Time Junction Temperature TIME, YEARS |
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