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TSS463B Datasheet(PDF) 9 Page - ATMEL Corporation |
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TSS463B Datasheet(HTML) 9 Page - ATMEL Corporation |
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9 / 24 page  TSS463B PPAP 9 Rev. 3 : Initial Submission – 2003 October 2.2.3 Package Technology Information Package weight 0.43 g Chip separation method Sawing Lead frame Material Cu Thickness 10 mils Size 270*270 mils 2 Lead plating Electroplated Sn/Pb 85/15 Die attach Material Silver epoxy Type Ablestick 84-1 LMISR4 Wire bonding Material Au Diameter 1.0 mil Method Thermosonic Molding Material NITTO MP8000AN Flammability rating UL94V-0 Marking Method Printed ink (top) and Laser (back) Drawing example Atmel TSS463B-TERA YYMM Zxxxxxxx Bonding Diagram |
Similar Part No. - TSS463B_03 |
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Similar Description - TSS463B_03 |
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