ZXMN2A02X8

ISSUE 2 - JANUARY 2005

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

113

°C/W

Junction to Ambient (b)

74.5

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature. Refer to

Transient Thermal Impedance graph. Refer to transient thermal impedance graph.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

20

V

Gate Source Voltage

20

V

7.8

6.3

6.2

A

Pulsed Drain Current (c)

39

A

Continuous Source Current (Body Diode) (b)

3.1

A

Pulsed Source Current (Body Diode) (c)

39

A

Linear Derating Factor

1.1

8.8

W

mW/°C

Linear Derating Factor

1.67

13.4

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS.