HI-8570, HI-8571

Notes:

1. All data taken in still air.

2. At 100% duty cycle, 5V power supplies.

3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms,C=30nF.

4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF

as this is considered unrealistic for high speed operation.

5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.

6. Similar results would be obtained with TXAOUT shorted to TXBOUT.

7. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

8. Data will vary depending on air flow and the method of heat sinking employed.

PACKAGE THERMAL CHARACTERISTICS

Maximum ARINC Load

TXAOUT and TXBOUT Shorted to Ground

6,7,8

HEAT SINK - ESOIC PACKAGES

An 8-pin thermally enhanced SOIC package is used for the

HI-8570/HI-8571 products. The ESOIC package includes

a metal heat sink located on the bottom surface of the

device. This heat sink should be soldered down to the

printed circuit board for optimum thermal dissipation. The

heat sink is electrically isolated from the chip and can be

soldered to any ground or power plane. However, since

the chip’s substrate is at V+, connecting the heat sink to

this power plane is recommended to avoid coupling noise

into the circuit.

PACKAGE STYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj C

DATA RATE

1

2

°

°°

°

°

°

°

Ta=25 C

Ta=85 C

Ta=125 C

Ta=25 C

Ta=85 C

Ta=125 C

Low Speed

20.98

20.96

20.96

38.24

98.34

138.92

High Speed

26.40

26.16

25.96

44.78

104.66

144.59

3

4

8 Lead Plastic ESOIC

5

PACKAGE STYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj C

DATA RATE

1

2

°

°°

°

°

°

°

Ta=25 C

Ta=85 C

Ta=125 C

Ta=25 C

Ta=85 C

Ta=125 C

Low Speed

30.26

29.22

28.46

53.75

112.76

152.04

High Speed

30.44

29.42

28.68

53.92

112.95

152.25

3

4

8 Lead Plastic ESOIC

5

HOLT INTEGRATED CIRCUITS

5