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PCF1179CT Datasheet(PDF) 11 Page - NXP Semiconductors |
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PCF1179CT Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 20 page 1997 Apr 16 11 Philips Semiconductors Product specification 4-digit duplex LCD car clock PCF1179C CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.7 Bonding pad locations, PCF1179CU; 28 terminals. Chip area: 5.61 mm2. Bonding pad dimensions: 110 µm × 110 µm. Chip thickness: 381 ±25 µm. MSB233 0 0 1.92 mm FLASH x SEL S2 B4/C4 G4/D4 F4/E4 B3/C3 G3/AD3 PCF1179CU OSC OUT OSC IN DATA S1 BP1 BP2 AM/PM A2/ADEG1 2.92 mm y |
Similar Part No. - PCF1179CT |
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Similar Description - PCF1179CT |
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