W25P80 AND W25P16

Publication Release Date: September 22, 2006

- 3 -

Revision L

9.2.8

Page Program (02h) .......................................................................................................20

9.2.9

Sector Erase (D8h).........................................................................................................21

9.2.10

Chip Erase (C7h)..........................................................................................................22

9.2.11

Power-down (B9h) ........................................................................................................23

9.2.12

Release Power-down / Device ID (ABh) .......................................................................23

9.2.13

Read Manufacturer / Device ID (90h) ...........................................................................25

9.2.14

JEDEC ID (9Fh) ...........................................................................................................26

9.2.15

Read Parameter Page (53h) ........................................................................................27

9.2.16

Fast Read Parameter Page (5Bh) ................................................................................28

9.2.17

Program Parameter Page (52h) ...................................................................................29

9.2.18

Erase Parameter Page (D5h) .......................................................................................31

10.

ELECTRICAL CHARACTERISTICS......................................................................................... 32

10.1

Absolute Maximum Ratings (1) .................................................................................... 32

10.2

Operating Ranges......................................................................................................... 32

10.3

Power-up Timing and Write Inhibit Threshold .............................................................. 33

10.4

DC Electrical Characteristics (Preliminary)(1) .............................................................. 34

10.5

AC Measurement Conditions........................................................................................ 35

10.6

AC Electrical Characteristics ........................................................................................ 36

10.7

Serial Output Timing ..................................................................................................... 38

10.8

Input Timing .................................................................................................................. 38

10.9

Hold Timing................................................................................................................... 38

11.

PACKAGE SPECIFICATION .................................................................................................... 39

11.1

8-Pin SOIC 208-mil (Winbond Package Code SS)....................................................... 39

11.2

16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 40

12.

ORDERING INFORMATION .................................................................................................... 41

13.

REVISION HISTORY ................................................................................................................42