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HI-1565PSIF Datasheet(PDF) 6 Page - Holt Integrated Circuits |
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HI-1565PSIF Datasheet(HTML) 6 Page - Holt Integrated Circuits |
6 / 9 page TA=25°C TA=85°C TA=125°C HI-1565CDI / T / M HI-1566CDI / T / M HI-1565PCI / T HI-1566PCI / T Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled. 62°C 122°C PACKAGE STYLE CONDITION ØJA 54°C/W JUNCTION TEMPERATURE 162°C HI-1565PSI / T / M HI-1566PSI / T / M Heat sink unsoldered Heat sink soldered 157°C 117°C 57°C PART NUMBER 129°C 169°C 47°C/W 44-pin Plastic chip- scale package Heat sink unsoldered 49°C/W 59°C 119°C 159°C 20-pin Thermally enhanced plastic SOIC (ESOIC) 20-pin Ceramic side-brazed DIP Socketed 62°C/W 69°C TXA/B TXA/B TXINHA/B TRANSMITTER BUSA/B BUSA/B 52.5 (.75 Zo) W 52.5 (.75 Zo) W 1.79:1 1:1.79 1:1.4 1.4:1 35 (.5 Zo) W Figure 3. Transformer Coupled Test Circuits HI-1565, HI-1566 THERMAL CHARACTERISTICS Coupling Transformer Coupling Transformer Isolation Transformer Isolation Transformer RECEIVER 52.5 (.75 Zo) W 52.5 (.75 Zo) W 35 (.5 Zo) W RXA/B RXA/B RXENA/B Point “A ” T Point “A ” T Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a 20-pin thermally enhanced SOIC package. The HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated and may be soldered to any convenient power or ground plane.. HEAT SINK - ESOIC & CHIP-SCALE PACKAGE HOLT INTEGRATED CIRCUITS 6 APPLICATIONS NOTE Holt Applications Note AN-500 provides circuit design notes regarding the use of Holt's family of MIL-STD-1553 transceivers. Layout considerations, as well as recommended interface and protection components are included. |
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