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ISL6312AIRZ Datasheet(PDF) 6 Page - Intersil Corporation |
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ISL6312AIRZ Datasheet(HTML) 6 Page - Intersil Corporation |
6 / 35 page 6 FN9290.2 February 15, 2007 Absolute Maximum Ratings Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V BOOT Voltage, VBOOT . . . . . . . . . . . . . . GND - 0.3V to GND + 36V BOOT to PHASE Voltage, VBOOT-PHASE . . . . . . -0.3V to 15V (DC) -0.3V to 16V (<10ns, 10µJ) PHASE Voltage, VPHASE . . . . . . . GND - 0.3V to 15V (PVCC = 12) GND - 8V (<400ns, 20µJ) to 24V (<200ns, VBOOT-PHASE = 12V) UGATE Voltage, VUGATE. . . . . . . . VPHASE - 0.3V to VBOOT + 0.3V VPHASE - 3.5V (<100ns Pulse Width, 2µJ) to VBOOT + 0.3V LGATE Voltage, VLGATE . . . . . . . . . . . GND - 0.3V to PVCC + 0.3V GND - 5V (<100ns Pulse Width, 2µJ) to PVCC+ 0.3V Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V ESD Classification . . . . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD Recommended Operating Conditions VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5% PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5% Ambient Temperature (ISL6312ACRZ) . . . . . . . . . . . . 0°C to +70°C Ambient Temperature (ISL6312AIRZ) . . . . . . . . . . . .-40°C to +85°C Thermal Information Thermal Resistance θJA (°C/W) θJC (°C/W) QFN Package (Notes 1, 2) . . . . . . . . . . +32 +3.5 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. NOTES: 1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 2. For θ JC, the “case temp” location is the center of the exposed metal pad on the package underside. 3. Parameter magnitude guaranteed by design. Not 100% tested. Electrical Specifications Recommended Operating Conditions, Unless Otherwise Specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS BIAS SUPPLIES Input Bias Supply Current IVCC; ENLL = high 15 20 25 mA Gate Drive Bias Current - PVCC1_2 Pin IPVCC1_2; ENLL = high 2 4.3 6 mA Gate Drive Bias Current - PVCC3 Pin IPVCC3; ENLL = high 1 2.1 3 mA VCC POR (Power-On Reset) Threshold VCC rising 4.25 4.38 4.50 V VCC falling 3.75 3.88 4.00 V PVCC POR (Power-On Reset) Threshold PVCC rising 4.25 4.38 4.50 V PVCC falling 3.60 3.88 4.00 V PWM MODULATOR Oscillator Frequency Accuracy, FSW RT = 100kΩ (± 0.1%) 225 250 275 kHz Adjustment Range of Switching Frequency (Note 3) 0.08 - 1.0 MHz Oscillator Ramp Amplitude, VPP (Note 3) - 1.50 - V CONTROL THRESHOLDS ENLL Rising Threshold -0.85 - V ENLL Hysteresis -110 - mV EN_PH4 Rising Threshold 1.160 1.210 1.250 V EN_PH4 Falling Threshold 1.00 1.06 1.10 V COMP Shutdown Threshold COMP falling 0.1 0.2 0.3 V ISL6312A ISL6312A |
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