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ISL6310 Datasheet(PDF) 8 Page - Intersil Corporation |
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ISL6310 Datasheet(HTML) 8 Page - Intersil Corporation |
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8 / 27 page  8 FN9209.3 December 12, 2006 one of four fixed reference voltages; see “Table 1” for correspondence between REF0 and REF1 inputs and reference voltage settings. These pins are internally pulled high, to approximately 1.2V, by 40 μA (typically) internal current sources; the internal pull- up current decreases to 0 as the REF0 and REF1 voltages approach the internal pull-up voltage. Both REF0 and REF1 pins are compatible with external pull-up voltages not exceeding the IC’s bias voltage (VCC). VSEN and RGND (Pins 8, 7) VSEN and RGND are inputs to the precision differential remote-sense amplifier and should be connected to the sense pins of the remote load. ICOMP, ISUM, and IREF (Pins 10, 12, 13) ISUM, IREF, and ICOMP are the DCR current sense amplifier’s negative input, positive input, and output respectively. For accurate DCR current sensing, connect a resistor from each channel’s phase node to ISUM and connect IREF to the summing point of the output inductors, roughly VOUT. A parallel R-C feedback circuit connected between ISUM and ICOMP will then create a voltage from IREF to ICOMP proportional to the voltage drop across the inductor DCR. This voltage is referred to as the droop voltage and is added to the differential remote-sense amplifier’s output An optional 0.001 to 0.01 μF ceramic capacitor can be placed from the IREF pin to the ISUM pin to help reduce common mode noise that might be introduced by the layout. DROOP (Pin 11) This pin enables or disables droop. Tie this pin to the ICOMP pin to enable droop. To disable droop, tie this pin to the IREF pin. VDIFF (Pin 6) VDIFF is the output of the differential remote-sense amplifier. The voltage on this pin is equal to the difference between VSEN and RGND added to the difference between IREF and ICOMP. VDIFF therefore represents the VOUT voltage plus the droop voltage. FB and COMP (Pins 5, 4) The internal error amplifier’s inverting input and output respectively. FB is connected to VDIFF through an external R or R-C network depending on the desired type of compensation (Type II or III). COMP is tied back to FB through an external R-C network to compensate the regulator. DAC (Pin 32) The DAC pin is the direct output of the internal DAC. This pin is connected to REF pin using 1 to 5k Ω resistor, This pin can be left open if an external reference is used. REF (Pin 1) The REF input pin is the positive input of the error amplifier. This pin can be connected to the DAC pin using a resistor (1-5k Ω) when the internal DAC voltage is used as the reference voltage. When an external voltage reference is used, it must be connected directly to the REF pin, while the DAC pin is left unconnected. The output voltage will be regulated to the voltage at the REF pin unless this voltage is greater than the voltage at the DAC pin. If an external reference is used at this pin, its magnitude cannot exceed 1.75V. A capacitor is used between the REF pin and ground to smooth the DAC voltage during soft-start. OFST (Pin 2) The OFST pin provides a means to program a DC current for generating an offset voltage across the resistor between FB and VDIFF. The offset current is generated via an external resistor and precision internal voltage references. The polarity of the offset is selected by connecting the resistor to GND or VCC. For no offset, the OFST pin should be left unconnected. OCSET (Pin 9) This is the overcurrent set pin. Placing a resistor from OCSET to ICOMP, allows a 100 μA current to flow out of this pin, producing a voltage reference. Internal circuitry compares the voltage at OCSET to the voltage at ISUM, and if ISUM ever exceeds OCSET, the overcurrent protection activates. ISEN1, ISEN2 (Pins 26, 16) These pins are used for balancing the channel currents by sensing the current through each channel’s lower MOSFET when it is conducting. Connect a resistor between the ISEN1 and ISEN2 pins and their respective phase node. This resistor sets a current proportional to the current in the lower MOSFET during its conduction interval. UGATE1 and UGATE2 (Pins 25, 17) Connect these pins to the upper MOSFETs’ gates. These pins are used to control the upper MOSFETs and are monitored for shoot-through prevention purposes. Maximum individual channel duty cycle is limited to 66%. BOOT1 and BOOT2 (Pins 24,18) These pins provide the bias voltage for the upper MOSFETs’ drives. Connect these pins to appropriately-chosen external bootstrap capacitors. Internal bootstrap diodes connected to the PVCC pins provide the necessary bootstrap charge. PHASE1 and PHASE2 (Pins 23, 19) Connect these pins to the sources of the upper MOSFETs. These pins are the return path for the upper MOSFETs’ drives. LGATE1 and LGATE2 (Pins 27, 14) These pins are used to control the lower MOSFETs and are monitored for shoot-through prevention purposes. Connect these pins to the lower MOSFETs’ gates. Do not use ISL6310 |
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