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FODB100, FODB101, FODB102 Rev. 1.0.0

Recommended Infrared Reflow Soldering Profile

Time (min.)

0.00

33.75

67.50

101.25

135.00

168.75

202.50

236.25

270.00

0.66

1.97

3.28

4.60

5.91

7.23

1.31

2.63

3.94

5.26

6.57

7.88

Entrance

Zone 1

Zone 2

Zone 3

Zone 4

Zone 5

Cooling

Average ramp-up rate (183

°C to peak)

Reflow Profile for Pb Free

Preheat Temperature 125(

±25)°C to 200°C

Temperature maintained above 220

°C

Time within 5

°C of actual peak temperature

Peak temperature range

Ramp down rate

Time 25

°C to peak temperature

3

°C/sec max

Convection Reflow

60-180

°C

60-150 sec

20-40 sec

260

±5°C

6

°C/sec max

8min max

Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome).