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FMS6346 Datasheet(PDF) 7 Page - Fairchild Semiconductor |
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FMS6346 Datasheet(HTML) 7 Page - Fairchild Semiconductor |
7 / 11 page FMS6346 Rev. 1B 7 www.fairchildsemi.com The same method can be used for biased signals with the addi- tion of a pull-up resistor to make sure the clamp never operates. The internal pull-down resistance is 800kΩ ±20% so the exter- nal resistance should be 7.5MΩ to set the DC level to 500mV. If a pull-up resistance less than 7.5MΩ is desired, an external pull-down can be added such that the DC input level is set to 500mV. Figure 14. Biased SCART with DC-coupled Outputs The same circuits can be used with AC-coupled outputs if desired. Figure 15. DC-coupled Inputs, AC-coupled Outputs Figure 16. AC-coupled Inputs, AC-coupled Outputs Figure 17. Biased SCART with AC-coupled Outputs NOTE: The video tilt or line time distortion will be dominated by the AC-coupling capacitor. The value may need to be increased beyond 220µF in order to obtain satisfactory operation in some applications. Power Dissipation The FMS6346 output drive configuration must be considered when calculating overall power dissipation. Care must be taken not to exceed the maximum die junction temperature. The fol- lowing example can be used to calculate the FMS6346’s power dissipation and internal temperature rise. Tj = TA + Pd • ΘJA where Pd = PCH1 + PCH2 + PCHx and PCHx = Vs • ICH - (VO 2/R L) where VO = 2Vin + 0.280V ICH = (ICC / 6) + (VO/RL) Vin = RMS value of input signal ICC = 60mA Vs = 5V RL = channel load resistance Board layout can also affect thermal characteristics. Refer to the Layout Considerations Section for more information. Layout Considerations General layout and supply bypassing play major roles in high frequency performance and thermal characteristics. Fairchild offers a demonstration board, FMS6346DEMO, to use as a guide for layout and to aid in device testing and characteriza- tion. The FMS6346DEMO is a 4-layer board with a full power and ground plane. Following this layout configuration will pro- vide the optimum performance and thermal characteristics. For optimum results, follow the steps below as a basis for high fre- quency layout: • Include 10µF and 0.1µF ceramic bypass capacitors • Place the 10µF capacitor within 0.75 inches of the power pin • Place the 0.1µF capacitor within 0.1 inches of the power pin •For multi-layer boards, use a large ground plane to help dissi- pate heat •For 2 layer boards, use a ground plane that extends beyond the device by at least 0.5” • Minimize all trace lengths to reduce series inductances LCVF Bias Input 0.1u External Video source must be AC-coupled. 500mV +/-350mV 75 Ω 7.5M Ω 75 Ω DVD or STB SoC DAC Output 75 Ω LCVF Clamp Inactive 0V - 1.4V 220u DVD or STB SoC DAC Output LCVF Clamp Active 0.1u 0V - 1.4V 75 Ω 220 μ LCVF Clamp Active 0.1 μ External video source must be AC-coupled. 500mV +/-350mV 220 μ 75 Ω 7.5M Ω 75 Ω |
Similar Part No. - FMS6346_06 |
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Similar Description - FMS6346_06 |
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