2

FN8138.1

May 2, 2006

PACKAGE DIAGRAM

PIN CONFIGURATIONS

Pin Name

Description

GND

Ground Connection

Power Supply Input Connection

Voltage Reference Output Connection

1

2

3

SOT-23

X60003x-41

GND

Ordering Information

PART NUMBER

PART

MARKING

GRADE

TEMP. RANGE (°C)

PACKAGE

(Tape and Reel)

X60003BIG3-41T1

AID

4.096

±1.0mV, 10ppm/°C

-40 to +85

3 Ld SOT-23

X60003BIG3Z-41T1 (Note)

APF

±1.0mV, 10ppm/°C

-40 to +85

3 Ld SOT-23 (Pb-Free)

X60003CIG3-41T1

AIE

±2.5mV, 20ppm/°C

-40 to +85

3 Ld SOT-23

X60003CIG3Z-41T1 (Note)

APH

±2.5mV, 20ppm/°C

-40 to +85

3 Ld SOT-23 (Pb-Free)

X60003DIG3-41T1

AIF

±5.0mV, 20ppm/°C

-40 to +85

3 Ld SOT-23

X60003DIG3Z-41T1

APJ

±5.0mV, 20ppm/°C

-40 to +85

3 Ld SOT-23

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

X60003B-41, X60003C-41, X60003D-41