3

FN8130.2

June 15, 2006

Pin Configuration

X5168V14-2.7A

X5168V AN

X5169V14-2.7A

X5168V AN

2.7-5.5

2.85-3.0

0 to 70

14 Ld TSSOP M14.173

X5168V14Z-2.7A

(Note)

X5168V Z AN X5169V14Z-2.7A

(Note)

X5169V Z AN

0 to 70

14 Ld TSSOP

(Pb-free)

M14.173

X5168V14I-2.7A

X5168V AP

X5169V14I-2.7A

X5169V AP

-40 to 85

14 Ld TSSOP M14.173

X5168V14IZ-2.7A

(Note)

X5168V Z AP X5169V14IZ-2.7A

(Note)

X5169V Z AP

-40 to 85

14 Ld TSSOP

(Pb-free)

M14.173

X5168P-2.7

X5168P F

X5169P-2.7

X5169P F

2.7-5.5

2.55-2.7

0 to 70

8 Ld PDIP

MDP0031

X5168PZ-2.7

(Note)

X5168P Z F

X5169PZ-2.7

(Note)

X5169P Z F

8 Ld PDIP**

(Pb-free)

MDP0031

X5168PI-2.7

X5168P G

X5169PI-2.7

X5169P G

-40 to 85

8 Ld PDIP

MDP0031

X5168PIZ-2.7

(Note)

X5168P Z G

X5169PIZ-2.7

(Note)

X5169P Z G

8 Ld PDIP**

(Pb-free)

MDP0031

X5168S8-2.7*

X5168 F

X5169S8-2.7*

X5169 F

0 to 70

8 Ld SOIC

MDP0027

X5168S8Z-2.7*

(Note)

X5168 Z F

X5169S8Z-2.7*

(Note)

X5169 Z F

8 Ld SOIC

(Pb-free)

MDP0027

X5168S8I-2.7*

X5168 G

X5169S8I-2.7*

X5169 G

-40 to 85

8 Ld SOIC

MDP0027

X5168S8IZ-2.7*

(Note)

X5168 Z G

X5169S8IZ-2.7*

(Note)

X5169 Z G

8 Ld SOIC

(Pb-free)

MDP0027

X5168V14-2.7*

X5168V F

X5169V14-2.7*

X5169V F

0 to 70

14 Ld TSSOP M14.173

X5168V14Z-2.7*

(Note)

X5168V Z F

X5169V14Z-2.7*

(Note)

X5169V Z F

0 to 70

14 Ld TSSOP

(Pb-free)

M14.173

X5168V14I-2.7*

X5168V G

X5169V14I-2.7*

X5168V G

-40 to 85

14 Ld TSSOP M14.173

X5168V14IZ-2.7*

(Note)

X5168V Z G

X5169V14IZ-2.7*

(Note)

X5168V Z G

-40 to 85

14 Ld TSSOP

(Pb-free)

M14.173

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are

MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

*Add "-T1" suffix for tape and reel.

**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

PART NUMBER

RESET

(ACTIVE LOW)

PART

MARKING

PART NUMBER

RESET

(ACTIVE HIGH)

PART

MARKING

(V)

(V)

TEMP

RANGE (°C)

PACKAGE

PKG.

DWG #

8 LD SOIC/PDIP

CS

WP

SO

1

2

3

4

RESET/RESET

8

7

6

5

14 LD TSSOP

SO

WP

1

2

3

4

5

6

7

RESET/RESET

SCK

SI

14

13

12

11

10

9

8

NC

NC

X5168/X5169

SCK

SI

CS

NC

NC

NC

NC

X5168/X5169

X5168, X5169