 |
 |
|
| X60003B-50_06 |
|
|||||||||||||||||
 INTERSIL
|
| |||||||||||||||||
|
2 page 
2 FN8137.1 May 2, 2006 PACKAGE DIAGRAM PIN CONFIGURATIONS Pin Name Description GND Ground Connection VIN Power Supply Input Connection VOUT Voltage Reference Output Connection 1 2 3 SOT-23 VOUT X60003x-50 GND VIN Ordering Information PART NUMBER PART MARKING VOUT (V) GRADE TEMP. RANGE (°C) PACKAGE (Tape and Reel) X60003BIG3-50T1 AHA 5.00 ±1.0mV, 10ppm/°C -40 to +85 3 Ld SOT-23 X60003BIG3Z-50T1 APG ±1.0mV, 10ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) X60003CIG3-50T1 AHB ±2.5mV, 20ppm/°C -40 to +85 3 Ld SOT-23 X60003CIG3Z-50T1 API ±2.5mV, 20ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) X60003DIG3-50T1 AHC ±5.0mV, 20ppm/°C -40 to +85 3 Ld SOT-23 X60003DIG3Z-50T1 APK ±5.0mV, 20ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. X60003B-50, X60003C-50, X60003D-50 |
