3

FN8125.1

May 30, 2006

X5001V8

501

4.5 to 5.5

4.25 to 4.5

0 to 70

8 Ld TSSOP (4.4mm)

M8.173

X5001V8Z (Note)

5001 Z

0 to 70

8 Ld TSSOP (4.4mm)

(Pb-free)

M8.173

X5001V8I

501 I

-40 to 85

8 Ld TSSOP (4.4mm)

M8.173

X5001V8IZ (Note)

5001 IZ

-40 to 85

8 Ld TSSOP (4.4mm)

(Pb-free)

M8.173

X5001PI-4.5A

X5001P AM

4.5 to 5.5

4.5 to 4.75

-40 to 85

8 Ld PDIP

MDP0031

X5001PIZ-4.5A

(Note)

X5001P ZAM

-40 to 85

8 Ld PDIP (300 mil)

(Pb-free)

MDP0031

X5001S8-4.5A

X5001 AL

0 to 70

8 Ld SOIC (150 mil)

MDP0027

X5001S8Z-4.5A

(Note)

X5001 ZAL

0 to 70

8 Ld SOIC (150 mil)

(Pb-free)

MDP0027

X5001S8I-4.5A

X5001 AM

-40 to 85

8 Ld SOIC (150 mil)

MDP0027

X5001S8IZ-4.5A

(Note)

X5001 ZAM

-40 to 85

8 Ld SOIC (150 mil)

(Pb-free)

MDP0027

X5001V8-4.5A

501 AL

0 to 70

8 Ld TSSOP (4.4mm)

M8.173

X5001V8Z-4.5A

(Note)

5001 ALZ

0 to 70

8 Ld TSSOP (4.4mm)

(Pb-free)

M8.173

X5001V8I-4.5A

501 AM

-40 to 85

8 Ld TSSOP (4.4mm)

M8.173

X5001V8IZ-4.5A

(Note)

5001 AMZ

-40 to 85

8 Ld TSSOP (4.4mm)

(Pb-free)

M8.173

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

PART NUMBER

PART MARKING

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

X5001