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ISL95810WIRT8Z Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL95810WIRT8Z Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 13 page 4 FN8090.2 September 19, 2006 ILkgDig Leakage Current, at Pins SDA, SCL, and WP Pins Voltage at pin from GND to VCC -10 10 µA tDCP (Note 13) DCP Wiper Response Time SCL falling edge of last bit of DCP Data Byte to wiper change 1µs Vpor Power-On Recall Voltage Minimum VCC at which memory recall occurs 1.8 2.6 V VCCRamp VCC Ramp Rate 0.2 V/ms tD (Note 13) Power-Up Delay VCC above Vpor, to DCP Initial Value Register recall completed, and I2C Interface in standby state 3ms EEPROM SPECIFICATIONS EEPROM Endurance 200,000 Cycles EEPROM Retention Temperature ≤ +75°C 50 Years SERIAL INTERFACE SPECIFICATIONS VIL WP, SDA, and SCL Input Buffer LOW Voltage -0.3 0.3*VCC V VIH WP, SDA, and SCL Input Buffer HIGH Voltage 0.7*VCC VCC+0.3 V Hysteresis (Note 13) SDA and SCL Input Buffer Hysteresis 0.05*VCC V VOL (Note 13) SDA Output Buffer LOW Voltage, Sinking 4mA 00.4 V Cpin (Note 13) WP, SDA, and SCL Pin Capacitance 10 pF fSCL SCL Frequency 400 kHz tIN (Note 13) Pulse Width Suppression Time at SDA and SCL Inputs Any pulse narrower than the max spec is suppressed. 50 ns tAA (Note 13) SCL Falling Edge to SDA Output Data Valid SCL falling edge crossing 30% of VCC, until SDA exits the 30% to 70% of VCC window. 900 ns tBUF (Note 13) Time the Bus Must be Free Before the Start of a New Transmission SDA crossing 70% of VCC during a STOP condition, to SDA crossing 70% of VCC during the following START condition. 1300 ns tLOW Clock LOW Time Measured at the 30% of VCC crossing. 1300 ns tHIGH Clock HIGH Time Measured at the 70% of VCC crossing. 600 ns tSU:STA START Condition Setup Time SCL rising edge to SDA falling edge. Both crossing 70% of VCC. 600 ns tHD:STA START Condition Hold Time From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC. 600 ns tSU:DAT Input Data Setup Time From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC 100 ns tHD:DAT Input Data Hold Time From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window. 0ns tSU:STO STOP Condition Setup Time From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC. 600 ns tHD:STO STOP Condition Hold Time for Read, or Volatile Only Write From SDA rising edge to SCL falling edge. Both crossing 70% of VCC. 600 ns tHD:STO:NV STOP Condition Hold Time for Non- Volatile Write From SDA rising edge to SCL falling edge. Both crossing 70% of VCC. 2µs tDH (Note 13) Output Data Hold Time From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window. 0ns tR (Note 13) SDA and SCL Rise Time From 30% to 70% of VCC 20 + 0.1 * Cb 250 ns tF (Note 13) SDA and SCL Fall Time From 70% to 30% of VCC 20 + 0.1 * Cb 250 ns Cb (Note 13) Capacitive Loading of SDA or SCL Total on-chip and off-chip 10 400 pF Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL PARAMETER TEST CONDITIONS MIN TYP (Note 1) MAX UNITS ISL95810 |
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