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5962-0620708Q2A Datasheet(PDF) 9 Page - Intersil Corporation |
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5962-0620708Q2A Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 9 FN6298.0 May 31, 2006 5962-0620705Q3A, 5962-0620706Q3A, 5962-0620707Q2A, 5962-0620708Q2A Ceramic Leadless Chip Carrier Packages (CLCC) D j x 45o D3 B h x 45o A A1 E L L3 e B3 L1 D2 D1 e1 E2 E1 L2 PLANE 2 PLANE 1 E3 B2 0.010 E H S S 0.010 E F S S -E- 0.007 E F M S HS B1 -H- -F- J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23 - B ---- - B1 0.022 0.028 0.56 0.71 2, 4 B2 0.072 REF 1.83 REF - B3 0.006 0.022 0.15 0.56 - D 0.342 0.358 8.69 9.09 - D1 0.200 BSC 5.08 BSC - D2 0.100 BSC 2.54 BSC - D3 -0.358 -9.09 2 E 0.342 0.358 8.69 9.09 - E1 0.200 BSC 5.08 BSC - E2 0.100 BSC 2.54 BSC - E3 -0.358 -9.09 2 e 0.050 BSC 1.27 BSC - e1 0.015 - 0.38 - 2 h 0.040 REF 1.02 REF 5 j 0.020 REF 0.51 REF 5 L 0.045 0.055 1.14 1.40 - L1 0.045 0.055 1.14 1.40 - L2 0.075 0.095 1.91 2.41 - L3 0.003 0.015 0.08 0.38 - ND 5 5 3 NE 5 5 3 N20 20 3 Rev. 0 5/18/94 NOTES: 1. Metallized castellations shall be connected to plane 1 terminals and extend toward plane 2 across at least two layers of ceramic or completely across all of the ceramic layers to make electrical connection with the optional plane 2 terminals. 2. Unless otherwise specified, a minimum clearance of 0.015 inch (0.38mm) shall be maintained between all metallized features (e.g., lid, castellations, terminals, thermal pads, etc.) 3. Symbol “N” is the maximum number of terminals. Symbols “ND” and “NE” are the number of terminals along the sides of length “D” and “E”, respectively. 4. The required plane 1 terminals and optional plane 2 terminals (if used) shall be electrically connected. 5. The corner shape (square, notch, radius, etc.) may vary at the manufacturer’s option, from that shown on the drawing. 6. Chip carriers shall be constructed of a minimum of two ceramic layers. 7. Dimension “A” controls the overall package thickness. The maxi- mum “A” dimension is package height before being solder dipped. 8. Dimensioning and tolerancing per ANSI Y14.5M-1982. 9. Controlling dimension: INCH. |
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