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ISL8484 Datasheet(PDF) 3 Page - Intersil Corporation |
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ISL8484 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 13 page 3 FN6128.2 September 13, 2006 Absolute Maximum Ratings Thermal Information V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V Input Voltages NO, NC, IN (Note 2). . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Output Voltages COM (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V) Continuous Current NO, NC, or COM . . . . . . . . . . . . . . . . . ±300mA Peak Current NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . ±500mA ESD Rating: HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>9kV MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV Thermal Resistance (Typical) θJA (°C/W) 10 Ld 3x3 TDFN Package (Note 3) . . . . . . . . . . . . . 90 10 Ld MSOP Package (Note 4) . . . . . . . . . . . . . . . . 140 Maximum Junction Temperature (Plastic Package). . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (Lead Tips Only) Operating Conditions Temperature Range ISL8484IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings. 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications - 3V Supply Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 5, 7), Unless Otherwise Specified PARAMETER TEST CONDITIONS TEMP (°C) (NOTE 6) MIN TYP (NOTE 6) MAX UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG Full 0 V+ V ON Resistance, RON V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+, (See Figure 5) 25 0.23 0.4 Ω Full 0.26 0.6 Ω RON Matching Between Channels, ∆RON V+ = 3.9V, ICOM = 100mA, VNO or VNC = Voltage at max RON, (Note 10) 25 0.03 Ω Full 0.04 Ω RON Flatness, RFLAT(ON) V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+, (Note 8) 25 0.03 Ω Full 0.04 Ω NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) V+ = 4.5V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V 25 -100 100 nA Full -195 195 nA COM ON Leakage Current, ICOM(ON) V + = 4.5V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V, or Floating 25 -100 100 nA Full -195 195 nA DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 3.9V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF, (See Figure 1, Note 9) 25 20 30 ns Full 35 ns Turn-OFF Time, tOFF V+ = 3.9V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF, (See Figure 1, Note 9) 25 15 25 ns Full 30 ns Break-Before-Make Time Delay, tD V+ = 4.5V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF, (See Figure 3, Note 9) Full 2 4 ns Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2) 25 128 pC OFF Isolation RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1VRMS, (See Figure 4) 25 68 dB Crosstalk (Channel-to-Channel) RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1VRMS, (See Figure 6) 25 -95 dB ISL8484 |
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