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ISL84781IV-T Datasheet(PDF) 11 Page - Intersil Corporation |
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ISL84781IV-T Datasheet(HTML) 11 Page - Intersil Corporation |
11 / 12 page 11 FN6095.3 July 31, 2006 ISL84781 Thin Shrink Small Outline Plastic Packages (TSSOP) NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimen- sions are not necessarily exact. (Angles in degrees) α INDEX AREA E1 D N 12 3 -B- 0.10(0.004) C A M BS e -A- b M -C- A1 A SEATING PLANE 0.10(0.004) c E 0.25(0.010) B M M L 0.25 0.010 GAUGE PLANE A2 0.05(0.002) M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.043 - 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - D 0.193 0.201 4.90 5.10 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC 0.65 BSC - E 0.246 0.256 6.25 6.50 - L 0.020 0.028 0.50 0.70 6 N16 16 7 α 0o 8o 0o 8o - Rev. 1 2/02 |
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