30 kHz-20 GHz GaAs MMIC

Optical Modulator Driver Amplifier

Page 2 of 2

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2006 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

CMM3020-BD

August 2006 - Rev 02-Aug-06

Ordering Information

Part Number for Ordering

System Application/Description

6

1

-

M

T

S

/

8

4

-

C

O

8

4

0

0

-

D

B

-

0

2

0

3

M

M

C

4

6

-

M

T

S

/

2

9

1

-

C

O

2

9

1

0

-

D

B

-

0

2

0

3

M

M

C

Absolute Maximum Ratings

g

n

i

t

a

R

r

e

t

e

m

a

r

a

P

V

2

1

e

g

a

t

l

o

V

n

i

a

r

D

V

5

-

e

g

a

t

l

o

V

e

t

a

G

A

m

0

5

3

t

n

e

r

r

u

C

n

i

a

r

D

Continuous Power Dissipation

3.0 W

Channel Temperature

+175°C

Storage Temperature

-65°C to +175°C

Mounting Temperature

+320°C

m

B

d

3

2

+

r

e

w

o

P

t

u

p

n

I

Die Attach and Bonding Procedures

Die Attach: Eutectic die attach is recommended. For eutec-

tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage

Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1

min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-

stressed); Thermocompression bonding is preferred over

thermosonic bonding.

For thermocompression bonding:

Stage Temperature: 250°C; Bond Tip Temperature: 150°C;

Bonding Tip Pressure: 18 to 40 gms depending on size of

wire.

Schematic Diagram