© 2004 Fairchild Semiconductor Corporation

DS500089

www.fairchildsemi.com

March 1998

Revised October 2004

74VCX16500

Low Voltage 18-Bit Universal Bus Transceivers with

3.6V Tolerant Inputs and Outputs

General Description

The VCX16500 is an 18-bit universal bus transceiver which

combines D-type latches and D-type flip-flops to allow data

flow in transparent, latched, and clocked modes.

Data flow in each direction is controlled by output-enable

(OEAB and OEBA), latch-enable (LEAB and LEBA), and

clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the

device operates in the transparent mode when LEAB is

HIGH. When LEAB is LOW, the A data is latched if CLKAB

is held at a HIGH or LOW logic level. If LEAB is LOW, the A

bus data is stored in the latch/flip-flop on the HIGH-to-LOW

transition of CLKAB. When OEAB is HIGH, the outputs are

active. When OEAB is LOW, the outputs are in a high-

impedance state.

Data flow for B to A is similar to that of A to B but uses

OEBA, LEBA, and CLKBA. The output enables are com-

plementary (OEAB is active HIGH and OEBA is active

LOW).

The VCX16500 is designed for low voltage (1.4V to 3.6V)

The 74VCX16500 is fabricated with an advanced CMOS

technology to achieve high speed operation while maintain-

ing low CMOS power dissipation.

Features

s 3.6V tolerant inputs and outputs

s Power-down high impedance inputs and outputs

s Supports live insertion/withdrawal (Note 1)

±24 mA @ 3.0V V

CC

s Uses patented noise/EMI reduction circuitry

s Latchup performance exceeds 300 mA

s ESD performance:

Human body model

> 2000V

Machine model

>200V

Note 1: To ensure the high-impedance state during power up or power

should be tied to GND through a pull-down resistors; the minimum value of

the resistor is determined by the current-sourcing capability of the driver.

Ordering Code:

Devices also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Order Number

Package Number

Package Description

74VCX16500MTD

MTD56

56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide