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Die Characteristics

DIE DIMENSIONS:

97 mils x 61 mils x 19 mils

METALLIZATION:

Type: Al

Thickness: 16kÅ

± 2kÅ

GLASSIVATION:

Type: Silox

Thickness: 14kÅ

± 2kÅ

WORST CASE CURRENT DENSITY:

TRANSISTOR COUNT:

78

PROCESS:

Bipolar-Di

Metallization Mask Layout

HS-2420RH

HS-2420RH