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AP1501-12K5A Datasheet(PDF) 8 Page - Anachip Corp

Part # AP1501-12K5A
Description  150Khz, 3A PWM Buck DC/DC Converter
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Manufacturer  ANACHIP [Anachip Corp]
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AP1501-12K5A Datasheet(HTML) 8 Page - Anachip Corp

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AP1501
150Khz, 3A PWM Buck DC/DC Converter
Anachip Corp.
www.anachip.com.tw
Rev.1.2 Aug. 23, 2005
8/12
Function Description
Pin Functions
+VIN
This is the positive input supply for the IC switching
regulator. A suitable input bypass capacitor must be
present at this pin to minimize voltage transients
and to supply the switching currents needed by the
regulator.
Ground
Circuit ground.
Output
Internal switch. The voltage at this pin switches
between (+VIN – VSAT) and approximately – 0.5V,
with a duty cycle of approximately VOUT / VIN. To
minimize coupling to sensitive circuitry, the PC
board copper area connected to this pin should be
kept a minimum.
Feedback
Senses the regulated output voltage to complete
the feedback loop.
ON /OFF
Allows the switching regulator circuit to be
shutdown using logic level signals thus dropping
the total input supply current to approximately
150uA. Pulling this pin below a threshold voltage of
approximately 1.3V turns the regulator on, and
pulling this pin above 1.3V (up to a maximum of
40V) shuts the regulator down. If this shutdown
feature is not needed, the ON /OFF pin can be
wired to the ground pin or it can be left open, in
either case the regulator will be in the ON condition.
Thermal Considerations
The AP1501 is available in two packages, a 5-pin
TO-220 and a 5-pin surface mount TO-263.
The TO-220 package needs a heat sink under most
conditions. The size of the heatsink depends on the
input voltage, the output voltage, the load current
and the ambient temperature. The AP1501 junction
temperature rises above ambient temperature for a
3A load and different input and output voltages.
The data for these curves was taken with the
AP1501 (TO-220 package) operating as a buck
switching regulator in an ambient temperature of
25
oC (still air). These temperature rise numbers are
all approximate and there are many factors that can
affect
these
temperatures.
Higher
ambient
temperatures require more heat sinking.
The TO-263 surface mount package tab is
designed to be soldered to the copper on a printed
circuit board. The copper and the board are the
heat sink for this package and the other heat
producing components, such as the catch diode
and inductor. The PC board copper area that the
package is soldered to should be at least 0.4 in
2,
and ideally should have 2 or more square inches of
2 oz. Additional copper area improves the thermal
characteristics, but with copper areas greater than
approximately 6 in
2, only small improvements in
heat dissipation are realized. If further thermal
improvements are needed, double sided, multilayer
PC board with large copper areas and/or airflow are
recommended.
The
AP1501
(TO-263
package)
junction
temperature rise above ambient temperature with a
2A load for various input and output voltages. This
data was taken with the circuit operating as a buck
switching regulator with all components mounted on
a PC board to simulate the junction temperature
under actual operating conditions. This curve can
be used for a quick check for the approximate
junction temperature for various conditions, but be
aware that there are many factors that can affect
the junction temperature.
When load currents
higher than 2A are used, double sided or multilayer
PC boards with large copper areas and/or airflow
might be needed, especially for high ambient
temperatures and high output voltages.
For the best thermal performance, wide copper
traces and generous amounts of printed circuit
board copper should be used in the board layout.
(Once exception to this is the output (switch) pin,
which should not have large areas of copper.)
Large areas of copper provide the best transfer of
heat (lower thermal resistance) to the surrounding
air, and moving air lowers the thermal resistance
even further.
This Anachip version datasheet is replaced
with Diodes Inc. datasheet AP1501
This Anachip version datasheet is replaced
with Diodes Inc. datasheet AP1501


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