DS30844 Rev. 3 - 2

1 of 5

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DDTA144ELP

© Diodes Incorporated

DDTA144ELP

PRE-BIASED (R1=R2) SMALL SIGNALSURFACE MOUNT 100mA PNP TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Ultra-Small Leadless Surface Mount Package

•

Ideally Suited for Automated Assembly Processes

•

Lead Free By Design/RoHS Compliant (Note 1)

•

"Green" Device (Note 2)

Mechanical Data

•

Case: DFN1006-3

•

Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminal Connections: Collector Dot (See Diagram)

•

Terminals: Finish — NiPdAu annealed over Copper

leadframe. Solderable per MIL-STD-202, Method 208

•

Marking Code P2, Dot denotes Collector Side

•

Ordering Information: See Page 4

•

Weight: 0.001 grams (approximate)

1

2

3

Fig. 1

1

3

IN

OUT

(or -supply)

B

C

E

GND (or +supply)

IN

C 3

E

2

1

R

2

R

1

B

+ Supply

or GND

OUT

(or -supply)

Equivalent Inverter Circuit

Schematic and Pin Configuration

Fig. 2

Component P/N

R1(NOM)

R2(NOM)

Figure

DDTA144ELP

47K

47K

2

Characteristic

Symbol

Value

Unit

Supply Voltage

-50

V

Input Voltage

+10 to -40

V

-100

mA

Power Dissipation (Note 3)

250

mW

Power Deration above 25°C

2

mW/°C

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Junction Operation and Storage Temperature Range

-55 to +150

°C

Thermal Resistance, Junction to Ambient Air (Note 3)

(Equivalent to one heated junction of NPN)

400

°C/W

Notes:

1.

No purposefully added lead.

2.

Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3.

Device mounted on FR-4 PCB, 1” x 0.85” x 0.062”; pad layout as shown on page 5 or Diodes Inc. suggested pad layout document AP02001,

which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.