Part Name
         Description
AM29LV010B_06

 1 Megabit (128 K x 8-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory ( 36 Page)


AMD
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October 11, 2006 22140D6
Am29LV010B
5
D A TA SH EE T
TABLE OF CONTENTS
Distinctive Characteristics 3
General Description 4
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Table 1. Am29LV010B Device Bus Operations .............................. 10
Requirements for Reading Array Data ................................... 10
Writing Commands/Command Sequences ............................ 10
Program and Erase Operation Status .................................... 11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 11
Output Disable Mode .............................................................. 11
Table 2. Am29LV010B Uniform Sector Address Table................... 11
Autoselect Mode ..................................................................... 12
Table 3. Am29LV010B Autoselect Codes....................................... 12
Sector Protection/Unprotection ............................................... 12
Hardware Data Protection ...................................................... 12
Command Definitions . . . . . . . . . . . . . . . . . . . . . 13
Reading Array Data ................................................................ 13
Reset Command ..................................................................... 13
Autoselect Command Sequence ............................................ 13
Byte Program Command Sequence ....................................... 13
Figure 1. Program Operation ..........................................................14
Chip Erase Command Sequence ........................................... 14
Sector Erase Command Sequence ........................................ 15
Erase Suspend/Erase Resume Commands ........................... 15
Figure 2. Erase Operation ...............................................................16
Command Definitions ............................................................. 17
Table 4. Am29LV010B Command Definitions ................................ 17
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 18
DQ7: Data# Polling ................................................................. 18
Figure 3. Data# Polling Algorithm ...................................................18
DQ6: Toggle Bit I .................................................................... 19
DQ2: Toggle Bit II ................................................................... 19
Reading Toggle Bits DQ6/DQ2 ............................................... 19
Figure 4. Toggle Bit Algorithm ........................................................ 20
DQ5: Exceeded Timing Limits ................................................ 20
DQ3: Sector Erase Timer ....................................................... 20
Table 5. Write Operation Status..................................................... 21
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 22
Figure 5. Maximum Negative Overshoot Waveform ...................... 22
Figure 6. Maximum Positive Overshoot Waveform ........................ 22
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 7. ICC1 Current vs. Time (Showing Active and Automatic
Sleep Currents) .............................................................................. 24
Figure 8. ICC1 vs. Frequency .......................................................... 24
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9. Test Setup ....................................................................... 25
Table 6. Test Specifications ........................................................... 25
Key to Switching Waveforms. . . . . . . . . . . . . . . . 25
Figure 10. Input Waveforms and Measurement Levels ................. 25
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26
Read Operations .................................................................... 26
Figure 11. Read Operations Timings ............................................. 26
Erase/Program Operations ..................................................... 27
Figure 12. Program Operation Timings .......................................... 28
Figure 13. Chip/Sector Erase Operation Timings .......................... 29
Figure 14. Data# Polling Timings (During Embedded Algorithms) . 30
Figure 15. Toggle Bit Timings (During Embedded Algorithms) ...... 30
Figure 16. DQ2 vs. DQ6 ................................................................. 31
Figure 17. Alternate CE# Controlled Write Operation Timings ...... 32
Erase and Programming Performance . . . . . . . . 32
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 33
TSOP Pin Package Capacitance . . . . . . . . . . . . . 33
PLCC Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 33
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 34
PL 032—32-Pin Plastic Leaded Chip Carrier ......................... 34
TS 032—32-Pin Standard Thin Small Outline Package ......... 35
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 36



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