AM29LV160B_05 datasheet(5/54 Pages) AMD | 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory

5 page

Am29LV160B

TABLE OF CONTENTS

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Handling Instructions ................................................... 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Standard Products .................................................................... 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV160B Device Bus Operations .............................. 10

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Sector Address Tables (Am29LV160BT) .......................... 13

Table 3. Sector Address Tables (Am29LV160BB).......................... 14

Autoselect Mode ..................................................................... 15

Table 4. Am29LV160B Autoselect Codes (High Voltage Method).. 15

Sector Protection/Unprotection ............................................... 15

Temporary Sector Unprotect .................................................. 16

Figure 1. Temporary Sector Unprotect Operation........................... 16

In-System Sector Protect/Unprotect Algorithms 17

Common Flash Memory Interface (CFI) . . . . . . . 18

Table 5. CFI Query Identification String .......................................... 18

Table 6. System Interface String..................................................... 19

Table 7. Device Geometry Definition .............................................. 19

Table 8. Primary Vendor-Specific Extended Query ........................ 20

Hardware Data Protection ...................................................... 20

Low VCC Write Inhibit .............................................................. 20

Write Pulse “Glitch” Protection ............................................... 20

Logical Inhibit .......................................................................... 20

Power-Up Write Inhibit ............................................................ 20

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 21

Reading Array Data ................................................................ 21

Reset Command ..................................................................... 21

Autoselect Command Sequence ............................................ 21

Word/Byte Program Command Sequence ............................. 21

Unlock Bypass Command Sequence ..................................... 22

Figure 3. Program Operation .......................................................... 22

Chip Erase Command Sequence ........................................... 22

Sector Erase Command Sequence ........................................ 23

Erase Suspend/Erase Resume Commands ........................... 23

Figure 4. Erase Operation............................................................... 24

Table 9. Am29LV160B Command Definitions................................. 25

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 26

DQ7: Data# Polling ................................................................. 26

Figure 5. Data# Polling Algorithm ................................................... 26

RY/BY#: Ready/Busy# ........................................................... 27

DQ6: Toggle Bit I .................................................................... 27

DQ2: Toggle Bit II ................................................................... 27

Reading Toggle Bits DQ6/DQ2 .............................................. 27

Figure 6. Toggle Bit Algorithm........................................................ 28

DQ3: Sector Erase Timer ....................................................... 29

Table 10. Write Operation Status................................................... 29

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 30

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 30

Commercial (C) Devices ......................................................... 30

Industrial (I) Devices ............................................................... 30

Extended (E) Devices ............................................................. 30

VCC Supply Voltages .............................................................. 30

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

CMOS Compatible .................................................................. 32

Zero Power Flash ................................................................... 33

Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep

Currents) ........................................................................................ 33

Figure 10. Typical ICC1 vs. Frequency ........................................... 33

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 11. Test Setup..................................................................... 34

Table 11. Test Specifications ......................................................... 34

Key to Switching Waveforms . . . . . . . . . . . . . . . 34

Figure 12. Input Waveforms and Measurement Levels ................. 34

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Read Operations .................................................................... 35

Figure 13. Read Operations Timings ............................................. 35

Hardware Reset (RESET#) .................................................... 36

Figure 14. RESET# Timings .......................................................... 36

Word/Byte Configuration (BYTE#) ........................................ 37

Figure 15. BYTE# Timings for Read Operations............................ 37

Figure 16. BYTE# Timings for Write Operations............................ 37

Erase/Program Operations ..................................................... 38

Figure 17. Program Operation Timings.......................................... 39

Figure 18. Chip/Sector Erase Operation Timings .......................... 40

Figure 19. Data# Polling Timings (During Embedded Algorithms). 41

Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 41

Figure 21. DQ2 vs. DQ6 for Erase and Erase

Suspend Operations ...................................................................... 42

Temporary Sector Unprotect .................................................. 42

Figure 22. Sector Protect/Unprotect Timing Diagram .................... 43

Alternate CE# Controlled Erase/Program Operations ............ 44

Figure 23. Alternate CE# Controlled Write Operation Timings ...... 45

Erase and Programming Performance . . . . . . . 46

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 46

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 46

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 47

TS 048—48-Pin Standard TSOP (measured in millimeters) .. 47

TSR048—48-Pin Reverse TSOP (measured in millimeters) .. 49

FBC048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 8 x 9 mm

(measured in millimeters) ....................................................... 50

SO 044—44-Pin Small Outline Package (measured in millime-

ters) ........................................................................................ 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

Revision F (January 1998) ...................................................... 52

Revision F+1 ........................................................................... 52

Revision F+2 ........................................................................... 52

Revision G (January 1999) ..................................................... 52

Revision G+1 (February 1999) ............................................... 52

Revision H (November 23, 1999) ........................................... 52

Revision H+1 (February 22, 2000) ......................................... 53

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