Notes:

1. All data taken

on devices soldered to a single layer copper PCB (3" X 4.5" X .062").

2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.

3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF

as this is considered unrealistic for high speed operation.

4. Similar results would be obtained with A

shorted to B

.

5. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

6. Data will vary depending on air flow and the method of heat sinking employed.

7. Current values listed are for each of the +V and -V supplies.

in still air

OUT

OUT

HI-318X PACKAGE THERMAL CHARACTERISTICS

HEAT SINK - ESOIC PACKAGES

Both the 14-pin and 16-pin thermally enhanced SOIC

packages are used for HI-318X products. These ESOIC

packages include a metal heat sink located on the bottom

surface of the device. This heat sink should be soldered

down to the printed circuit board for optimum thermal

dissipation. The heat sink is electrically isolated from the

chip and can be soldered to any ground or power plane.

However, since the chip’s substrate is at +V, connecting

the heat sink to this power plane is recommended to avoid

coupling noise into the circuit.

ØJA

JUNCTION TEMPERATURE, Tj

PACKAGE STYLE

HEAT SINK

SUPPLY CURRENT

(°C/W)

TA = 25°C TA = 85°C TA = 125°C

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

1

2

Unsoldered

82

36 mA

57°C

147°C

187°C

Soldered

65

36 mA

78°C

138°C

178°C

Unsoldered

51

40 mA

64°C

124°C

164°C

Soldered

28

40 mA

53°C

113°C

153°C

N/A

70

63 mA

100°C

150°C

182°C

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

28-pin Plastic

PLCC

ØJA

JUNCTION TEMPERATURE, Tj

PACKAGE STYLE

HEAT SINK

SUPPLY CURRENT

(°C/W)

TA = 25°C TA = 85°C TA = 125°C

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

1

2

Unsoldered

82

20 mA

57°C

117°C

157°C

Soldered

65

20 mA

51°C

111°C

151°C

Unsoldered

51

20 mA

45°C

105°C

145°C

Soldered

28

20 mA

36°C

96°C

136°C

N/A

70

25 mA

56°C

110°C

150°C

14-pin Thermally

Enhanced Plastic

SOIC (ESOIC)

28-pin Plastic

PLCC

MAXIMUM ARINC LOAD

3, 6, 7

A

and B

Shorted to Ground

OUT

OUT

3, 4, 5, 6, 7

HOLT INTEGRATED CIRCUITS

5

HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188