TXA/B

TXA/B

TXINHA/B

TRANSMITTER

BUSA/B

BUSA/B

52.5

(.75 Zo)

W

52.5

(.75 Zo)

W

1.79:1

1:1.79

1:1.4

1.4:1

35

(.5 Zo)

W

Figure 3. Transformer Coupled Test Circuits

THERMAL CHARACTERISTICS

Coupling

Transformer

Coupling

Transformer

Isolation

Transformer

Isolation

Transformer

RECEIVER

52.5

(.75 Zo)

W

52.5

(.75 Zo)

W

35

(.5 Zo)

W

RXA/B

RXA/B

RXENA/B

Point

“A ”

T

Point

“A ”

T

HEAT SINK - ESOIC & CHIP-SCALE

PACKAGE

Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20-

pin thermally enhanced SOIC package. The HI-

1573PCI/T and HI-1574PCI/T use a plastic chip-scale

package. These packages include a metal heat sink

located on the bottom surface of the device. This heat

sink should be soldered down to the printed circuit board

for optimum thermal dissipation.

The heat sink is

electrically isolated and may be soldered to any

convenient power or ground plane..

HI-1573CDI / T / M

HI-1574CDI / T / M

HI-1573PCI / T

HI-1574PCI / T

Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.

20-pin Ceramic

side-brazed DIP

Socketed

62°C/W

56°C

116°C

156°C

47°C/W

44-pin Plastic chip-

scale package

Heat sink

unsoldered

49°C/W

50°C

110°C

150°C

20-pin Thermally

enhanced plastic

SOIC (ESOIC)

JUNCTION TEMPERATURE

152°C

HI-1573PSI / T / M

HI-1574PSI / T / M

Heat sink

unsoldered

Heat sink

soldered

149°C

109°C

49°C

PART NUMBER

PACKAGE STYLE

CONDITION

54°C/W

52°C

112°C

HOLT INTEGRATED CIRCUITS

6

APPLICATIONS NOTE

Holt Applications Note AN-500 provides circuit design

notes regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.

HI-1573, HI-1574