2

FN3180.5

July 21, 2005

Ordering Information

PART NUMBER

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG.

#

ICL7663SCBA*

0 to 70

8 Ld SOIC (N)

M8.15

ICL7663SCBAZA*

(See Note)

0 to 70

8 Ld SOIC (N)

(Pb-free)

M8.15

ICL7663SCPA

0 to 70

8 Ld PDIP

E8.3

ICL7663SCPAZ

(See Note)

0 to 70

8 Ld PDIP**

(Pb-free)

E8.3

ICL7663SACBA*

0 to 70

8 Ld SOIC (N)

M8.15

ICL7663SACBAZA*

(See Note)

0 to 70

8 Ld SOIC (N)

(Pb-free)

M8.15

ICL7663SACPA

0 to 70

8 Ld PDIP

E8.3

ICL7663SAIBA

-25 to 85

8 Ld SOIC (N)

M8.15

ICL7663SAIBAZA

(See Note)

-25 to 85

8 Ld SOIC (N)

(Pb-free)

M8.15

*Add “-T” suffix to part number for tape and reel packaging.

**Pb-free PDIPs can be used for through hole wave solder

processing only. They are not intended for use in Reflow solder

processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free

material sets; molding compounds/die attach materials and 100%

matte tin plate termination finish, which are RoHS compliant and

compatible with both SnPb and Pb-free soldering operations. Intersil

Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

ICL7663S