HIN241IB datasheet(8/20 Pages) INTERSIL

Part #	HIN241IB

Description	5V Powered RS-232 Transmitters/Receivers

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Manufacturer	INTERSIL [Intersil Corporation]

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8

Absolute Maximum Ratings

Thermal Information

VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V

V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V

V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V

Input Voltages

TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)

RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V

Output Voltages

TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)

ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)

Short Circuit Duration

TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

Operating Conditions

Temperature Range

HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC

HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC

Thermal Resistance (Typical, Note 3)

θJA (oC/W)

16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . .

90

24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .

70

16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

100

24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

75

28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

70

28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .

95

44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .

80

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC

(SOIC, SSOP, MQFP - Lead Tips Only)

*Pb-free PDIPs can be used for through hole wave solder processing

only. They are not intended for use in Reflow solder processing

applications.

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

2. Only HIN239. For V+ > 11V, C1 must be

≤0.1µF.

3.

θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Electrical Specifications

Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

SUPPLY CURRENTS

Power Supply Current, ICC

No Load,

TA = 25

oC

HIN232

-

5

10

mA

HIN236-HIN238, HIN240-HIN241

-

7

15

mA

HIN239

-

0.4

1

mA

V+ Power Supply Current, ICC

No Load, TA = 25

oC

No Load,

TA = 25

oC

HIN239

-

5.0

15

mA

Shutdown Supply Current, ICC(SD)

TA = 25

oC-

1

10

µA

LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS

Input Logic Low, VlL

TIN, EN, Shutdown

-

0.8

V

Input Logic High, VlH

TIN

2.0

-

V

EN, Shutdown

2.4

-

V

Transmitter Input Pullup Current, IP

TIN = 0V

-

15

200

µA

TTL/CMOS Receiver Output Voltage Low, VOL

IOUT = 1.6mA

-

0.1

0.4

V

TTL/CMOS Receiver Output Voltage High, VOH

IOUT = -1.0mA

3.5

4.6

-

V

RECEIVER INPUTS

RS-232 Input Voltage Range VIN

-30

-

+30

V

Receiver Input Impedance RIN

VIN = ±3V

3.0

5.0

7.0

k

Ω

Receiver Input Low Threshold, VlN (H-L)

VCC = 5V, TA = 25

oC0.8

1.2

-

V

Receiver Input High Threshold, VIN (L-H)

VCC = 5V, TA = 25

oC-

1.7

2.4

V

Receiver Input Hysteresis VHYST

0.2

0.5

1.0

V

HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241

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