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ICM7211AM Datasheet(PDF) 3 Page - Intersil Corporation |
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ICM7211AM Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 8 page 3 FN3158.7 April 17, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage (VDD - VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V Input Voltage (Any Terminal) (Note 1) . . . VSS - 0.3V to VDD, + 0.3V Operating Conditions Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C Thermal Resistance (Typical, Note 2) θJA (°C/W) PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . .-65×°C to 150°C Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300°C *Pb-free PDIPs can be used for through hole wave solder process- ing only. They are not intended for use in Reflow solder processing applications. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than VDD or less than VSS may cause destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same power supply be applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211AM be turned on first. 2. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS CHARACTERISTICS VDD = 5V ±10%, TA = 25°C, VSS = 0V Unless Otherwise Specified Operating Supply Voltage Range (VDD - VSS), VSUPPLY 356 V Operating Current, IDD Test circuit, Display blank - 10 50 µA Oscillator Input Current, IOSCI Pin 36 - ±2 ±10 µA Segment Rise/Fall Time, tr, tf CL = 200pF - 0.5 - µs Backplane Rise/Fall Time, tr, tf CL = 5000pF - 1.5 - µs Oscillator Frequency, fOSC Pin 36 Floating - 19 - kHz Backplane Frequency, fBP Pin 36 Floating - 150 - Hz INPUT CHARACTERISTICS Logical “1” Input Voltage, VIH 4- - V Logical “0” Input Voltage, VIL -- 1 V Input Leakage Current, IILK Pins 27-34 - ±0.01 ±1 µA Input Capacitance, ClN Pins 27-34 - 5 - pF BP/Brightness Input Leakage, IBPLK Measured at Pin 5 with Pin 36 at VSS - ±0.01 ±1 µA BP/Brightness Input Capacitance, CBPI All Devices - 200 - pF AC CHARACTERISTICS Chip Select Active Pulse Width, tWL Other Chip Select Either Held Active, or Both Driven Together 200 - - ns Data Setup Time, tDS 100 - - ns Data Hold Time, tDH 10 0 - ns Inter-Chip Select Time, tICS 2- - µs ICM7211AM ICM7211AM |
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