Lead-free

DS18004 Rev. 28 - 2

1 of 4

BZT52C2V0 - BZT52C39

www.diodes.com

·

Planar Die Construction

·

500mW Power Dissipation on Ceramic PCB

·

General Purpose, Medium Current

·

Ideally Suited for Automated Assembly Processes

·

Lead Free/RoHS Compliant (Note 2)

·

Qualified to AEC-Q101 Standards for High Reliability

Maximum Ratings

°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Power Dissipation (Note 1)

500

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

250

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

2. No purposefully added lead.

Mechanical Data

BZT52C2V0 - BZT52C39

SURFACE MOUNT ZENER DIODE

·

Case: SOD-123

·

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

·

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Solderable per MIL-STD-202,

Method 208

·

Lead Free Plating (Matte Tin Finish annealed over

Alloy 42 leadframe)

·

Polarity: Cathode Band

·

Marking: See Below

·

Weight: 0.01 grams (approximate)

Marking Information

XX

XX = Product Type Marking Code (See Page 2)

YM = Date Code Marking

Y = Year (ex: N = 2002)

M = Month (ex: 9 = September)

Date Code Key

Month

Jan

Feb

March

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

12

3

4

5

6

7

89

O

N

D

Year

1998

1999

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

Code

JK

L

M

N

P

R

ST

U

V

W

Features

A

B

C

D

E

G

H

J

SOD-123

Dim

Min

Max

A

3.55

3.85

B

2.55

2.85

C

1.40

1.70

D

—

1.35

E

0.45

0.65

0.55 Typical

G

0.25

—

H

0.11 Typical

J

—

0.10

a

0

°

8

°

All Dimensions in mm

SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1

BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16

BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39