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127Z Datasheet(PDF) 10 Page - Intersil Corporation |
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127Z Datasheet(HTML) 10 Page - Intersil Corporation |
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10 / 13 page  10 FN3076.13 December 21, 2005 Die Characteristics DIE DIMENSIONS: 53 mils x 52 mils x 19 mils 1340 µm x 1320µm x 483µm METALLIZATION: Type: Metal 1: AlCu(2%)/TiW Thickness: Metal 1: 8k Å ±0.4kÅ Type: Metal 2: AlCu(2%) Thickness: Metal 2: 16k Å ±0.8kÅ PASSIVATION: Type: Nitride Thickness: 4k Å ±0.5kÅ PROCESS: UHF-1 SUBSTRATE POTENTIAL: (POWERED UP) Unbiased Metallization Mask Layout HFA3096, HFA3127, HFA3128 HFA3046 Pad numbers correspond to SOIC pinout. 1 2 3 4 5 6 78 9 10 11 12 13 14 15 16 1320 µm (52 mils) 1340 µm (53 mils) 1 2 3 4 5 6 78 9 10 11 12 13 14 1320 µm (52 mils) 1340 µm (53 mils) HFA3046, HFA3096, HFA3127, HFA3128 |
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