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TRF1223IRTMT Datasheet(PDF) 7 Page - Texas Instruments |
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TRF1223IRTMT Datasheet(HTML) 7 Page - Texas Instruments |
7 / 13 page www.ti.com 0.25 TYP 0.75 TYP 0.75 TYP SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS OR ON GROUND CONNECTIONS. 25 VIA HOLES, MIN, EACH 0.38 mm. DIMENSIONS in mm DIA 0.38 TYP 0.60 TYP 3.50 3.50 3.80 0.50 TYP 0.20 TYP PIN 1 Additional Copper Ground and via Holes at Customer Discreation 8 Mil Prepreg Dia 15 Mil 10 Mil Core FR4 10 Mil Core FR4 1 oz Copper 1 oz Copper DuPont CB 100 Conductive Via Plug 1/2 oz Copper Plated 1 oz Copper + 1/2 oz Copper Plated Upper and Lower Surfaces 35 Mil TRF1223 SLWS166C – APRIL 2005 – REVISED MARCH 2007 Figure 6. Recommended Pad Layout Figure 7. Via Cross Section 7 Submit Documentation Feedback |
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