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TRF1122IRTMTG3 Datasheet(PDF) 4 Page - Texas Instruments |
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TRF1122IRTMTG3 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 10 page www.ti.com TRF1122 SLWS173B – APRIL 2005 – REVISED SEPTEMBER 2006 TERMINAL FUNCTIONS TERMINAL I/O TYPE DESCRIPTION NO. NAME Not connected for normal operation. Amplifier Bias Adjustment. Do not ground this pin or 1 IADJ connect to any other pin. 2 VDD2 I Power RF amplifier bias +5 V 3, 5, 9, 11, 15, 16, 21, GND Ground 28–30, 32 4 UCATTN I Digital Logic high is high gain, Logic low reduces gain by 16 dB. Normally set high. 6 RFO O Analog RF output from RF amplifier Not connected for normal operation. LO common gate bias adjustment. Do not ground this 7 LOADJ1 pin or connect to any other pin. Negative bias used for enable circuitry -5 V. This pin can be grounded if the user does not 8 VNEG I Power use the UCEN pin to turnoff the amplifier. If the VNEG is grounded the UCEN pin should be tied high. Not connected for normal operation. LO amplifier bias adjustment. Do not ground this pin or 10 LOADJ2 connect to any other pin. 12 LOP I Analog LO input, Positive, Internally ac coupled 13 LON I Analog LO input, Negative, Internally ac coupled. 14 VDDLO I Power Positive power for LO amplifier, +5 V. 17 VDDIFN I Analog VDD supply for IF amplifier, negative, +5 V 18 VDDIFP I Analog VDD supply for IF amplifier, positive, +5 V 19 IFIP I Analog IF input, positive, dc coupled, Typical dc voltage is 1.2 V. 20 IFIN I Analog IF input, negative, dc coupled Typical dc voltage is 1.2 V. 22 MXRO O Analog Output of mixer (after balun) 50 Ω impedance with high impedance DC ground. 23 UCEN Digital Set HIGH to enable IF amplifier and RF amplifiers 24 MXRADJ I Analog Normally grounded. Provide 0 Ω jumper to ground. Not connected for normal operation. IF amplifier bias adjustment. Do not ground this pin or 25 IFADJ I connect to any other pin. 26 VDDIF I Power Positive supply for IF bias circuitry +5 V 27 RFI I Analog Input to RF amplifier, 50 Ω impedance, Internally AC coupled 31 VDDI I Power RF amplifier bias +5 V Back GND Back of package has metal base that must be grounded for thermal and RF performance. 4 Submit Documentation Feedback |
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