TRF1123IRTMRG3 datasheet(9/13 Pages) TI

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3.80

0.25 TYP

0.50 TYP

SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS

OR ON GROUND CONNECTIONS.

25 VIA HOLES, EACH 0.38 mm.

DIMENSIONS in mm

DIA 0.38

TYP

0.60 TYP

3.80

3.50

0.20 TYP

0.75 TYP

PIN 1

TRF1123

SLWS167B – APRIL 2005 – REVISED SEPTEMBER 2006

Table 2. PCB Recommendations (continued)

Prepreg Thickness

8 mil

Recommended Number of Layers

4

Via Plating Thickness

0.5 oz

Final Plate

White immersion tin

Final Board Thickness

33-37 mil

Figure 11. Recommended Pad Layout

9

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