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HA3-2840-5 Datasheet(PDF) 7 Page - Intersil Corporation |
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HA3-2840-5 Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 7 page 7 Die Characteristics DIE DIMENSIONS: 65 mils x 52 mils x 19 mils 1650 µm x 1310µm x 483µm METALLIZATION: Type: Aluminum, 1% Copper Thickness: 16k Å ±2kÅ PASSIVATION: Type: Nitride over Silox Silox Thickness: 12k Å ±2kÅ Nitride thickness: 3.5k Å ±1kÅ SUBSTRATE POTENTIAL (Powered Up): V- TRANSISTOR COUNT: 34 PROCESS: High Frequency Bipolar Dielectric Isolation Metallization Mask Layout HA-2840 V- +IN -IN OUT V+ HA-2840 |
Similar Part No. - HA3-2840-5 |
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Similar Description - HA3-2840-5 |
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