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HA3-2839-9 Datasheet(PDF) 7 Page - Harris Corporation |
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HA3-2839-9 Datasheet(HTML) 7 Page - Harris Corporation |
7 / 7 page 3-7 Die Characteristics DIE DIMENSIONS: 65 mils x 52 mils x 19 mils 1650 µm x 1310µm x 483µm METALLIZATION: Type: Aluminum, 1% Copper Thickness: 16k Å ±2kÅ SUBSTRATE POTENTIAL V- PASSIVATION: Type: Nitride over Silox Silox Thickness: 12k Å ±2kÅ Nitride thickness: 3.5k Å ±1kÅ TRANSISTOR COUNT: 34 PROCESS: High Frequency Bipolar Dielectric Isolation Metallization Mask Layout HA-2839 V- +IN -IN OUT V+ HA-2839 |
Similar Part No. - HA3-2839-9 |
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