SN65C3222, SN75C3222

3V TO 5.5V MULTICHANNEL RS232 COMPATIBLE LINE DRIVER/RECEIVER

SLLS534B − MAY 2002 − REVISED OCTOBER 2004

1

POST OFFICE BOX 655303

±15 kV Using Human-Body Model (HBM)

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The SN65C3222 and SN75C3222 consist of two line drivers, two line receivers, and a dual charge-pump circuit

with

±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The devices provide the

electrical interface between an asynchronous communication controller and the serial-port connector. The

charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices

operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/

µs to 150 V/µs.

The SN65C3222 and SN75C3222 can be placed in the power-down mode by setting PWRDOWN low, which

draws only 1

µA from the power supply. When the devices are powered down, the receivers remain active while

the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is

high-impedance state by setting EN high.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (DW)

Tube of 25

SN75C3222DW

75C3222

SOIC (DW)

Reel of 2000

SN75C3222DWR

75C3222

−0

°C to 70°C

SSOP (DB)

Reel of 2000

SN75C3222DBR

CA3222

−0 C to 70 C

TSSOP (PW)

Tube of 70

SN75C3222PW

CA3222

TSSOP (PW)

Reel of 2000

SN75C3222PWR

CA3222

SOIC (DW)

Tube of 25

SN65C3222DW

65C3222

SOIC (DW)

Reel of 2000

SN65C3222DWR

65C3222

−40

°C to 85°C

SSOP (DB)

Reel of 2000

SN65C3222DBR

CB3222

−40 C to 85 C

TSSOP (PW)

Tube of 70

SN65C3222PW

CB3222

TSSOP (PW)

Reel of 2000

SN65C3222PWR

CB3222

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Copyright

 2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DB, DW, OR PW PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

EN

C1+

V+

C1−

C2+

C2−

V−

DOUT2

RIN2

ROUT2

PWRDOWN

GND

DOUT1

RIN1

ROUT1

NC

DIN1

DIN2

NC

NC − No internal connection

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.