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SGA-9189Z Datasheet(PDF) 4 Page - SIRENZA MICRODEVICES |
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SGA-9189Z Datasheet(HTML) 4 Page - SIRENZA MICRODEVICES |
4 / 4 page Broomfield, CO 80021 4 EDS-101497 Rev H 303 S. Technology Ct. Phone: (800) SMI-MMIC http://www.sirenza.com SGA-9189 Medium Power Discrete SiGe Transistor Caution: ESD sensitive Appropriate precautions in handling, packaging and testing devices must be observed. r e b m u N t r a Pe z i S l e e Rl e e R / s e c i v e D 9 8 1 9 - A G S" 3 10 0 0 3 Z 9 8 1 9 - A G S" 3 10 0 0 3 The part will be symbolized with the “P1” (“P1Z” for RoHS version) designator and a dot signifying pin 1 on the top surface of the package. Part Symbolization # n i Pn o i t c n u Fn o i t p i r c s e D 1e s a Bt u p n I F R 2r e t t i m Ed a e l e c u d e r o t s e l o h a i v e s U . d n u o r g o t n o i t c e n n o C . e l b i s s o p s a s d a e l d n u o r g o t e s o l c s a s a i v e c a l P . e c n a t c u d n i 3r o t c e ll o Ct u p t u O F R 4r e t t i m E2 n i P s a e m a S Pin Description Mounting and Thermal Considerations It is very important that adequate heat sinking be provided to minimize the device junction temperature. The following items should be implemented to maximize MTTF and RF performance. 1. Multiple solder-filled vias are required directly below the ground tab (pin 4). [CRITICAL] 2. Incorporate a large ground pad area with multiple plated- through vias around pin 4 of the device. [CRITICAL] 3. Use two point board seating to lower the thermal resistance between the PCB and mounting plate. Place machine screws as close to the ground tab (pin 4) as possible. [RECOMMENDED] 4. Use 2 ounce copper to improve the PCB’s heat spreading capability. [RECOMMENDED] SOT-89 Package Machine Screws Plated Thru Holes (0.020" DIA) Ground Plane .016 .118 .019 .096 .041 .177 .068 .059 .015 .161 DIMENSIONS ARE IN INCHES Package Dimensions Part Number Ordering Information Recommended Mounting Configuration for Optimum RF and Thermal Performance |
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