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SGA-9189Z Datasheet(PDF) 4 Page - SIRENZA MICRODEVICES

Part # SGA-9189Z
Description  Medium Power Discrete SiGe Transistor
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Manufacturer  SIRENZA [SIRENZA MICRODEVICES]
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SGA-9189Z Datasheet(HTML) 4 Page - SIRENZA MICRODEVICES

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Broomfield, CO 80021
4
EDS-101497 Rev H
303 S. Technology Ct.
Phone: (800) SMI-MMIC
http://www.sirenza.com
SGA-9189 Medium Power Discrete SiGe Transistor
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
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The part will be symbolized with the “P1” (“P1Z”
for RoHS version) designator and a dot signifying
pin 1 on the top surface of the package.
Part Symbolization
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Pin Description
Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to
minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF performance.
1. Multiple solder-filled vias are required directly below the
ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-
through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal resistance
between the PCB and mounting plate. Place machine screws
as close to the ground tab (pin 4) as possible. [RECOMMENDED]
4. Use 2 ounce copper to improve the PCB’s heat spreading
capability. [RECOMMENDED]
SOT-89
Package
Machine
Screws
Plated Thru
Holes
(0.020" DIA)
Ground Plane
.016
.118
.019
.096
.041
.177 .068
.059
.015
.161
DIMENSIONS ARE IN INCHES
Package Dimensions
Part Number Ordering Information
Recommended Mounting Configuration for
Optimum RF and Thermal Performance


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