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B57321V2102+060 Datasheet(PDF) 3 Page - EPCOS |
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B57321V2102+060 Datasheet(HTML) 3 Page - EPCOS |
3 / 4 page 52 05/02 Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Test conditions ∆R 25/R25 (typical) Remarks Storage in dry heat IEC 60068-2-2 JIS C 0021 Storage at upper category temperature T: (125 ± 2) °C t: 1000 h < 2 % Storage in damp heat, steady state IEC 60068-2-3 JIS C 0022 Temperature of air: (40 ± 2) °C Relative humidity of air: (93 +2 /–3) % Duration: 56 days < 2 % Rapid temperature cycling IEC 60068-2-14 JIS C 0025 Lower test temperature: – 55 °C Upper test temperature: 125 °C Number of cycles: 100 < 2 % Endurance Pmax: 180 mW T: (65 ± 2) °C t: 1000 h < 2 % Solderability IEC 60068-2-58 JIS C 0054 Solderability: (215 ± 3) °C / (3 ± 0,3) s (235 ± 5) °C / (2 ± 0,2) s Resistance to soldering heat: (260 ± 5) °C / (10 ± 1) s 95 % of terminations wetted Resistance drift after soldering Reflow soldering profile Wave soldering profile < 1 % B573** Temperature Measurement V3** SMD NTC Thermistors with Nickel Barrier Termination, Size 0603 |
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