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SY89832UMG Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY89832UMG Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 10 page 3 Precision Edge® SY89832U Micrel, Inc. M9999-020707 hbwhelp@micrel.com or (408) 955-1690 February 2007 Absolute Maximum Ratings(1) Supply Voltage (V CC) .................................. –0.5V to +4.0V Input Voltage (V IN) ............................... –0.5V to VCC +0.3V LVDS Output Current (I OUT) .................................... ±10mA Input Current Source or Sink Current on (IN, /IN) .................. ±50mA VREF-AC Current Source or Sink Current on (I VT) .......................... ±2mA Lead Temperature (soldering, 20sec.) ...................... 260°C Storage Temperature (T S) ....................... –65°C to +150°C Operating Ratings(2) Supply Voltage Range .......................... +2.375V to 2.625V Ambient Temperature (T A) ......................... –40°C to +85°C Package Thermal Resistance(3) MLF® (θJA) Still-Air ........................................................ 60°C/W (ψJB) .................................................................... 32°C/W T A = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units V CC Power Supply 2.375 2.5 2.625 V I CC Power Supply Current No load, max. V CC.75 100 mA R IN Input Resistance (IN-to-VT) 45 50 55 Ω R DIFF-IN Differential Input Resistance (IN-to-/IN) 80 100 120 Ω V IH Input HIGH Voltage (IN, /IN) V CC–1.2 V CC V V IL Input LOW Voltage (IN, /IN) 0 V IH –0.1 V V IN Input Voltage Swing (IN, /IN) see Figure 2c. 0.1 1.7 V V DIFF_IN Differential Input Voltage Swing |IN – /IN| see Figure 2d. 0.2 V V REF–AC Output Reference Voltage V CC–1.525 VCC–1.425 VCC–1.325 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ψ JB and θJA values are determined for a 4-layer board in stil-air number, unless otherrwise stated. 4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. DC ELECTRICAL CHARACTERISTICS(4) |
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