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SY89533L Datasheet(PDF) 9 Page - Micrel Semiconductor |
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SY89533L Datasheet(HTML) 9 Page - Micrel Semiconductor |
9 / 15 page 9 Precision Edge® SY89534/35L Micrel, Inc. M9999-110405 hbwhelp@micrel.com or (408) 955-1690 REFCLK Input Interface The flexible REFCLK inputs are designed to accept any differential to single-ended input signal within 300mV above VCC and 300mV below ground. Do not leave unused REFCLK inputs floating. Tie either the true or complement inputs to ground, but not both. A logic zero is achieved by connecting the complement input to ground with the true input floating. For a TTL input, tie a 2.5k Ω resistor between the complement input and ground. See “Input Interface” section, Figures 4a through 4j. Input Levels LVDS, CML and HSTL differential signals may be connected directly to the REFCLK inputs. Depending on the actual worst case voltage seen, the minimum input voltage swing varies as illustrated in the following table: Input Voltage Range Minimum Voltage Swing 0 to 2.4V 100mV 0 to VCC +0.3 200mV R2 1.5k R2 1.5k R1 1.05k R1 1.05k GND REFCLK VCC /REFCLK Figure 3. Simplified Input Structure Output Logic Characteristics See “Output Termination Recommendations” for illustrations. In cases where single-ended output is desired, the designer should terminate the unused complimentary output in the same manner as the normal output that is being used. Unused LVPECL output pairs can be left floating. Unused LVDS output pairs should be terminated w/100 Ω across the pair. LVPECL operation: • Typical voltage swing is 700mV PP to 800mVPP into 50 Ω. • Common mode voltage is V CC–1.3V, typical. • 100 Ω termination across the output pair is NOT recommended for LVPECL. See “Output Termination” section, Figures 3 to 5. LVDS operation (SY89535L, Bank B) • Typical voltage swing is 250mV PP to 450mVPP into effective 50 Ω. • Common mode voltage is 1.25V, typical. • 100 Ω termination across differential output pair is fine. Thermal Considerations This part has an exposed die pad for enhanced heat dissipation. We strongly recommend soldering the exposed die pad to a ground plane. Where this is not possible, we recommend maintaining at least 500lfpm air flow around the part. |
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