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SY89465U Datasheet(PDF) 5 Page - Micrel Semiconductor

Part No. SY89465U
Description  Precision LVDS 1:10 Fanout with 2:1 Runt Pulse Eliminator MUX and Internal Termination
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Maker  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
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Micrel, Inc.
SY89465U
December 2005
M9999-120105-A
hbwhelp@micrel.com or (408) 955-1690
5
Absolute Maximum Ratings(1)
Supply Voltage (VCC) ............................ –0.5V to +4.0V
Input Voltage (VIN) ....................................–0.5V to VCC
Input Current (IIN) ...........................................................
Source/Sink Current on IN, /IN................... ±50mA
Source/Sink Current on VT .......................±100mA
VREF-AC Current
Source/Sink Current on VREF-AC.................... ±2mA
Lead Temperature (soldering, 20 sec.)............ +260°C
Storage Temperature (Ts) ...................–65°C to 150°C
Operating Ratings(2)
Supply Voltage (VCC) ....................+2.375V to +2.625V
Ambient Temperature (TA) ..................–40°C to +85°C
Package Thermal Resistance
(3)
MLF™ (θ JA)
Still-Air ..................................................... 24.4°C/W
MLF™ (ψ JB)
Junction-to-Board ..................................... 8.1°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max VCC
250
325
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a. Note 5.
0.1
2.5
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VT_IN
IN-to-VT
(IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and
ψJB values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN (max) is specified when VT is floating.




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