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SY89223L Datasheet(PDF) 5 Page - Micrel Semiconductor

Part No. SY89223L
Description  3.3V DUAL DIFFERENTIAL LVPECL-to-LVTTL TRANSLATOR
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Maker  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
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 5 page
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5
Precision Edge®
SY89223L
Micrel, Inc.
M9999-051805
hbwhelp@micrel.com or (408) 955-1690
8 LEAD ULTRA-SMALL EPAD-
MicroLeadFrame™ (MLF-8)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
VEE
VEE
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF™ Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
Note 1.
Package meets level two qualification.
Note 2.
All parts are dry-packaged before shipment.
Note 3.
Exposed pads must be soldered to a ground plane, of the same potential as the device GND
pin, for proper thermal management.
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.




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