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BZX84J-C18 Datasheet(PDF) 9 Page - NXP Semiconductors |
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BZX84J-C18 Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 12 page BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 9 of 12 NXP Semiconductors BZX84J series Single Zener diodes 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 13. 10. Soldering Fig 7. Package outline SOD323F (SC-90) 04-09-13 Dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BZX84J-B2V4 to BZX84J-C75 SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD323F (SC-90) msa433 1.65 0.50 (2 ×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste |
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Similar Description - BZX84J-C18 |
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